制程能力-信彩彩票投注平台有限公司-官方网站

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                深圳市益豪快捷电子有限公司

                位置:首页 > 工艺流程 > 制程能力
                Process 工序项目 Items 参数 Specs
                Layer 层数
                FPC0~6 Layer
                Rigid- Flex PcB 软硬结板2~16 Laver
                FR-41~32 Layer
                Size process 尺寸加工FPCOnesideboard:230*800mm,DSB双面板:200*400mm
                Rigid- Flex PcB 软硬结板200*500mm( over size need access) 超过此尺寸,需要评估
                FR-4800*2000mm
                Drilling Tolerance 钻孔公差Max Drilling Diameter 最大钻孔孔径6.4mm
                Min Drilling Diameter 最小钻孔孔径0.1mm
                Min slot 最小槽孔0.6mm(<0.6 mm laser cutting) 激光切割
                Drilling tolerance 空位置公差First Drilling 一次钻孔+/0.05mm, Second drilling 二次钻孔+/0.1mmb
                Drilling after diameter tolerance 钻孔后径公差PTH Drilling Tolerance 孔径公差+/00 mm NPTH Drilling Tolerance 孔径公差:005.0m
                Copper Thickness 铜厚公差
                Common DSB 普通双面板≥8um
                Multilayer Board 多层板≥15um
                Rigid-Flex PCB 软硬结合≥20um If have special requirments 客户特殊
                Common 常规10~25um
                Circuit Width/space 线路间距Min Drilling Ring 最小孔环0.15mm
                1oz copper width/space 最小线宽/线距Singleboar 单面板:0.08mm/0.07mm
                DSB 双面板:0.09mm/0.075mm
                1/2oz copper width/space 最小线宽/线距0.07mm/0.07mm
                1oz copper etching 铜底蚀刻补偿0.04mm
                1/2oz copper etching 铜底蚀刻补偿0.03mm
                1/3oz copper etching 铜底蚀刻补偿0.02mm
                Min NPTH drill to width 线距离最小0.2mm
                Alignment 对准的Two side match deviation 两面对位偏差+/-0.075mm
                Coincident accuraly 重合精度+/-0.075mm
                Single side accuracy 单面对位精度+/-0.05mm
                DESEtching Width/Space Tolerance 蚀刻线宽线距Wdth 线宽:+20%
                Finishing 表面处理

                Nickel thickness 镍层厚度

                1~7um
                Gold Thickness 金层厚度0.05~0.5um
                Tin Thickness 锡层厚度0.3~1.0um
                OSP Thickness OSP 厚度0.2~0.6um
                Gold Thickness 金层厚度0.025~0075um
                STMCorrespond Substrate 对应基板L810*W480mm
                Theory Speed 理论速度

                5Million Point/Day

                Machine accuracy 机器精度

                +-0.03mm/Chip
                Correspond Component 元件BGA Space 0.35mm




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